Carbon Nanotubes for Interconnects [electronic resource] : Process, Design and Applications / edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci.

Інтелектуальна відповідальність: Вид матеріалу: Текст Публікація: Cham : Springer International Publishing : Imprint: Springer, 2017Видання: 1st ed. 2017Опис: XII, 333 p. 167 illus., 133 illus. in color. online resourceТип вмісту:
  • text
Тип засобу:
  • computer
Тип носія:
  • online resource
ISBN:
  • 9783319297460
Тематика(и): Додаткові фізичні формати: Printed edition:: Немає назви; Printed edition:: Немає назви; Printed edition:: Немає назвиДесяткова класифікація Дьюї:
  • 621.3815 23
Класифікація Бібліотеки Конгресу:
  • TK7888.4
Електронне місцезнаходження та доступ:
Вміст:
Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.
У: Springer eBooksЗведення: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
Тип одиниці: ЕКнига Списки з цим бібзаписом: Springer Ebooks (till 2020 - Open Access)+(2017 Network Access)) | Springer Ebooks (2017 Network Access))
Мітки з цієї бібліотеки: Немає міток з цієї бібліотеки для цієї назви. Ввійдіть, щоб додавати мітки.
Оцінки зірочками
    Середня оцінка: 0.0 (0 голос.)
Немає реальних примірників для цього запису

Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.

Available to subscribing member institutions only. Доступно лише організаціям членам підписки.

Online access from local network of NaUOA.

Online access with authorization at https://link.springer.com/

Онлайн-доступ з локальної мережі НаУОА.

Онлайн доступ з авторизацією на https://link.springer.com/

Немає коментарів для цієї одиниці.

для можливості публікувати коментарі.