Testing of Interposer-Based 2.5D Integrated Circuits (Запис № 448180)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04254nam a22005775i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-319-54714-5 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20210118132417.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 170320s2017 gw | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9783319547145 |
| -- | 978-3-319-54714-5 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-3-319-54714-5 |
| Source of number or code | doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7888.4 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJFC |
| Source | bicssc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008010 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJFC |
| Source | thema |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.3815 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Wang, Ran. |
| Relator term | author. |
| Relator code | aut |
| -- | http://id.loc.gov/vocabulary/relators/aut |
| 245 10 - TITLE STATEMENT | |
| Title | Testing of Interposer-Based 2.5D Integrated Circuits |
| Medium | [electronic resource] / |
| Statement of responsibility, etc | by Ran Wang, Krishnendu Chakrabarty. |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2017. |
| 264 #1 - | |
| -- | Cham : |
| -- | Springer International Publishing : |
| -- | Imprint: Springer, |
| -- | 2017. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | XIV, 182 p. 118 illus., 102 illus. in color. |
| Other physical details | online resource. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Introduction -- Pre-Bond Testing of the Silicon Interposer -- Post-Bond Scan-based Testing of Interposer Interconnects -- Test Architecture and Test-Path Scheduling -- Built-In Self-Test -- ExTest Scheduling and Optimization -- A Programmable Method for Low-Power Scan Shift in SoC Dies -- Conclusions.-. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Provides a single-source guide to the practical challenges in testing of 2.5D ICs; Presents an efficient method to locate defects in a passive interposer before stacking; Describes an efficient interconnect-test solution to target through-silicon vias (TSVs), the redistribution layer, and micro-bumps for shorts, opens, and delay faults; Provides a built-in self-test (BIST) architecture that can be enabled by the standard TAP controller in the IEEE 1149.1 standard; Discusses two ExTest scheduling strategies to implement interconnect testing between tiles inside an SoC die; Includes a programmable method for shift-clock stagger assignment to reduce power supply noise during SoC die testing in 2.5D ICs. |
| 506 ## - RESTRICTIONS ON ACCESS NOTE | |
| Terms governing access | Available to subscribing member institutions only. Доступно лише організаціям членам підписки. |
| 506 ## - RESTRICTIONS ON ACCESS NOTE | |
| Standardized terminology for access restriction | Online access from local network of NaUOA. |
| 506 ## - RESTRICTIONS ON ACCESS NOTE | |
| Standardized terminology for access restriction | Online access with authorization at https://link.springer.com/ |
| 506 ## - RESTRICTIONS ON ACCESS NOTE | |
| Standardized terminology for access restriction | Онлайн-доступ з локальної мережі НаУОА. |
| 506 ## - RESTRICTIONS ON ACCESS NOTE | |
| Standardized terminology for access restriction | Онлайн доступ з авторизацією на https://link.springer.com/ |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronic circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Microprocessors. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Logic design. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Circuits and Systems. |
| -- | http://scigraph.springernature.com/things/product-market-codes/T24068 |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Processor Architectures. |
| -- | http://scigraph.springernature.com/things/product-market-codes/I13014 |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Logic Design. |
| -- | http://scigraph.springernature.com/things/product-market-codes/I12050 |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Chakrabarty, Krishnendu. |
| Relator term | author. |
| Relator code | aut |
| -- | http://id.loc.gov/vocabulary/relators/aut |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Printed edition: |
| International Standard Book Number | 9783319547138 |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Printed edition: |
| International Standard Book Number | 9783319547152 |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Printed edition: |
| International Standard Book Number | 9783319854618 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://doi.org/10.1007/978-3-319-54714-5">https://doi.org/10.1007/978-3-319-54714-5</a> |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | ЕКнига |
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