TY  - BOOK
AU  - Horiuchi,Shin
AU  - Terasaki,Nao
AU  - Miyamae,Takayuki
ED  - SpringerLink (Online service)
TI  - Interfacial Phenomena in Adhesion and Adhesive Bonding
SN  - 9789819944569
AV  - TA418.7-418.76 
U1  - 620.44 23
PY  - 2024///
CY  - Singapore
PB  - Springer Nature Singapore, Imprint: Springer
KW  - Surfaces (Technology)
KW  - Thin films
KW  - Materials
KW  - Analysis
KW  - Spectrum analysis
KW  - Polymers
KW  - Surfaces, Interfaces and Thin Film
KW  - Materials Characterization Technique
KW  - Spectroscopy
N1  - Introduction – Interfaces in adhesion and adhesive bonding -- 2. Electron microscopy for visualization of interfaces in adhesion and adhesive bonding -- Interfacial phenomena in adhesion and adhesive bonding investigated by electron microscopy -- Direct visualization of mechanical behavior during adhesive bonding failure using mechanoluminescence (ML) -- Analysis of molecular surface/interfacial layer by sum-frequency generation (SFG) spectroscopy; Open Access
N2  - This open access book reviews the recent research achievements of the investigation of interfacial phenomena in polymer/polymer and polymer/metal joint interfaces with the state-of-the-art analytical techniques not previously used in the field of adhesion and bonding. Adhesion performance is determined not only by the two-dimensional interfaces but also by a three-dimensional (3D) region having different properties and structural characteristics that extends into the bulk materials. In this book, the authors also discuss in detail the bonding mechanism by characterizing such 3D regions called “interphase”. The book is of great interest to researchers and engineers devoted to adhesion science and technology. Videos via app: download the SN More Media app for free, scan an image or a link with play button, and access videos directly on your smartphone or tablet
UR  - https://doi.org/10.1007/978-981-99-4456-9
ER  -