000 04603nam a22005775i 4500
001 978-3-319-29746-0
003 DE-He213
005 20210118124431.0
007 cr nn 008mamaa
008 160709s2017 gw | s |||| 0|eng d
020 _a9783319297460
_9978-3-319-29746-0
024 7 _a10.1007/978-3-319-29746-0
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
082 0 4 _a621.3815
_223
245 1 0 _aCarbon Nanotubes for Interconnects
_h[electronic resource] :
_bProcess, Design and Applications /
_cedited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci.
250 _a1st ed. 2017.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2017.
300 _aXII, 333 p. 167 illus., 133 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aInterconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.
520 _aThis book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
650 0 _aElectronic circuits.
650 0 _aMicroprocessors.
650 1 4 _aCircuits and Systems.
_0http://scigraph.springernature.com/things/product-market-codes/T24068
650 2 4 _aProcessor Architectures.
_0http://scigraph.springernature.com/things/product-market-codes/I13014
650 2 4 _aElectronic Circuits and Devices.
_0http://scigraph.springernature.com/things/product-market-codes/P31010
700 1 _aTodri-Sanial, Aida.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aDijon, Jean.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aMaffucci, Antonio.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9783319297446
776 0 8 _iPrinted edition:
_z9783319297453
776 0 8 _iPrinted edition:
_z9783319806426
856 4 0 _uhttps://doi.org/10.1007/978-3-319-29746-0
912 _aZDB-2-ENG
999 _c446538
_d446538
942 _cEB
506 _aAvailable to subscribing member institutions only. Доступно лише організаціям членам підписки.
506 _fOnline access from local network of NaUOA.
506 _fOnline access with authorization at https://link.springer.com/
506 _fОнлайн-доступ з локальної мережі НаУОА.
506 _fОнлайн доступ з авторизацією на https://link.springer.com/